Your partner and solution provider for thermal management of microelectronics and electrical systems.
Expertise – Our team brings over 30 years of combined experience in analysis of thermal problems, design of novel cooling concepts and implementation of thermal management solutions. Our unique expertise is single and two-phase liquid cooling at device and chip-level packaging position us to address the growing challenges in cooling compact and high power density electronics.
Facilities – Founded at the Université de Sherbrooke, we have access to vast facilities at the 3IT (Interdisciplinary Institute for Technological Innovation) in Sherbrooke, QC and C2MI (MIQro Innovation Collaborative Center) in Bromont, QC. These include laboratories for thermal and fluidic characterisation, microfabrication and rapid prototyping, as well as advanced microsystem packaging.
Dr. Shirazy obtained his PhD from Université de Sherbrooke (2013), Sherbrooke (QC), Canada, in thermofluids, heat pipe and thermal management. He has experience in heat pipe and vapour chamber fabrication and modeling, thermal interface materials (TIMs), LED thermal management, MEMS and Li-ion battery thermal management. He has won multiple research awards including Audience choice award in Micro &
Nano Tech. Society-wide Forum Poster Competition ASME IMECE 2014, American Society of Mechanical Engineering (ASME) electronic and photonic packaging division (EPPD) student member of the year award for 2013 and outstanding paper award in the conference InterPACK2013.
Some examples of our work in the field.